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Ⅰ．学術論文
1) 呉 勇波，庄司克雄，厨川常元，センタレス研削に関する研究(第1報)－研削抵抗の測定について－，精密工学会誌，Vol. 61, No.3, （1995）, pp.411-414.
2) 呉 勇波，庄司克雄，厨川常元，立花 亨，センタレス研削に関する研究(第2報)－最適研削条件の設定について－，精密工学会誌，Vol. 62,
No.3, （1996），pp.433-437.
3) Y. Wu，K. Syoji and T. Kuriyagawa, Investigation of Centerless Grinding
-Grinding Force Measurement-, Int. J. Japan Soc. Prec. Eng., Vol. 33, No.3,
（1999）, pp.185-190.
4) 呉 勇波，庄司克雄，厨川常元，立花 亨，センタレス研削に関する研究(第3報)－加工条件の評価関数について－，精密工学会誌，Vol. 65,
No.6, （1999），pp.862-866.
5) 呉 勇波，庄司克雄，厨川常元，立花 亨，センタレス研削に関する研究（工作物真円度に対する研削砥石外周面うねりおよび偏心の影響），日本機械学会論文集（C編），Vol.66，No.649，（2000），pp.3162-3167.
6) 呉 勇波，庄司克雄，厨川常元，立花 亨，加藤正名，センタレス研削における研削抵抗動的成分を用いた加工条件の評価，精密工学会誌，Vol.37，No.9，（2001）,
pp.1443-1447.
7) 厨川常元，吉原信人，呉 勇波，庄司克雄，ハイレシプロ成形研削面における垂直縞の発生機構について，精密工学会誌，Vol.37，No.8，（2001）,
pp.1317-1321.
8) 呉 勇波，厨川常元，加藤正名，庄司克雄，立花 亨，センタレスインフィード研削における調整砥石の偏摩耗と加工精度への影響，日本機械学会論文集（C編），Vol.68，No.671，（2002）, pp.2145-2150.
9) 呉 勇波，加藤正名，庄司克雄，厨川常元，立花 亨，調整車を用いないセンタレス研削法の開発―実験装置の試作と二，三の研削テストー，砥粒加工学会誌，Vol.46，No.10，（2002）,
pp.510-514.
10) Y. Wu, Y. Fan, M. Kato, J. Wang, K. Syoji and T. Kuriyagawa, A New
Centerless Grinding Method without Employing Regulating wheel, Key Engineering
Materials, Vols.238-9，（2002）, pp.355-360.
11) K. Shimada, Y. Wu and Y. C. Wong, Effect of Magnetic Cluster and Magnetic Field on Polishing Using Magnetic Compound Fluid (MCF), Journal of Magnetism and Magnetic Materials, Vol.262, (2003), pp.242-247.
12) H. Cheng, Z. Feng and Y. Wu, Fabrication of Off-axis Aspherical Mirrors
with Loose Abrasive Point-contact Machining, Key Engineering Materials,
Vols.257-8，（2003）, pp.153-158.
13) Y. Zhang, Z. Feng, H. Tam and Y. Wu, Pressure-based Grinding and Polishing
of Free-form Lens, Key Engineering Materials, Vols.257-8，（2003）, pp.401-406.
14) 呉 勇波， 野村光由， 加藤正名， 立花 亨，超音波振動を援用した小径内面の精密研削に関する研究―超音波振動スピンドルの試作と基本研削特性―，砥粒加工学会誌，Vol.47, No.10 (2003), pp.550-555.
15) Y. Wu, Y. Fan, M. Kato, T. Tachibana, K. Syoji and T. Kuriyagawa, Determination
of an Optimum Geometrical Arrangement of Workpiece in the Ultrasonic Elliptic-vibration
Shoe Centerless Grinding, Key Engineering Materials, Vols.257-258，（2004）,
pp.495-500.
16) Y. Fan, Y. Wu, M. Kato, T. Tachibana, K. Syoji and T. Kuriyagawa, Design
of an Ultrasonic Elliptic-Vibration Shoe and its Performance in Ultrasonic
Elliptic-Vibration-Shoe Centerless Grinding, JSME International Journal,
Series C, Vol. 47, No. 1 (2004), pp.43-51.
17) 呉 勇波，範 玉峰，立花 亨，加藤正名，庄司克雄，厨川常元，調整車を用いないセンタレス研削法の開発―工作物の幾何学的支持条件が加工精度へ及ぼす影響，砥粒加工学会誌，Vol.48，No.5，（2004）, pp.263-268.
18) Y. Wu, Y. Fan, M. Kato, T. Kuriyagawa, K. Syoji and T. Tachibana, Development
of an Ultrasonic Elliptic Vibration Shoe Centerless Grinding Technique,
Journal of Materials Processing Technology, Vols.155-6, (2004), pp. 1780-1787.
19) Y. Wu, M. Nomura, Z. Feng and M. Kato, Modeling of Grinding Force in
Constant-Depth-of-Cut Ultrasonically Assisted Grinding, Materials Science
Forum, Vols.471-2，(2004), pp.6-10.
20) X. Wang, Y. Wu, Study on Incident Angle and Focus Offset when Laser Machining Nonplanar Parts, Aeronautic Manufacturing Technology, Vol.253, (2004), pp.129-132. (in Chinese)
21) H. Cheng，Z. Feng and Y. Wu, Process Technology of Aspherical Mirrors
Manufacturing with Magnetorheological Finishing, Materials Science Forum,
Vols.471-2，(2004), pp.101-106.
22) K. Shimada, S. Shuchi, H. Kanno, Y. WU and S. Kamiyama, Magnetic Cluster
and its Applications, Journal of Magnetism and Magnetic Materials, Vol.
289, (2005), pp.9-12.
23) Y. Wu, T. Kondo, M. Kato, A new centerless grinding technique using a surface grinder, Journal of Materials Processing Technology, Vols.162-3, (2005), pp.709-717.
24) K. Shimada, Y. Wu, Y. Matsuo, K. Yamamoto, Float polishing technique
using new tool consisting of micro magnetic clusters, Journal of Materials
Processing Technology, Vol.162-3, (2005), pp.690-695.
25) X. Wang, Y. Wu, J. Wang, W. Xu, M. Kato, Absorbed energy in laser truing
of a small vitrified CBN grinding wheel, Journal of Materials Processing
Technology, Vols.164-5, (2005), pp.1128-1133.
26) Y. Wu, Y. Fan, T. Tachibana and M. Kato, Effect of Ultrasonic Elliptic Vibration on Friction Between Shoe and Workpiece in Ultrasonic Elliptic-Vibration Shoe Centerless Grinding, Key Engineering Materials, Vol.291-2, (2005), pp.33-38.
27) Y. Wu, K. Shimada, Y. C. Wong and M. Kato, Effects of Particles Blend
Ratio on Surface Quality in Surface Polishing Using Magnetic Polishing
Liquid (MPL), Key Engineering Materials, Vol.291-2, (2005), pp.337-342.
28) M. Nomura, Y. Wu, M. Kato and T. Kuriyagawa, Effects of Ultrasonic
Vibration in the Truing and Dressing of CBN Grinding Wheel used for Internal
grinding of Small Holes, Key Engineering Materials, Vols.291-2, (2005),
pp.183-188.
29) X. Wang, Y. Wu, R. Kang, J. Wang, W. Xu and M. Kato, Energy-mode adjustment in laser processing a small vitrified CBN grinding wheel, Key Engineering Materials, Vols. 291-2, (2005), pp.177-182.
30) Y. Wu, K. Shimada,Y. C. Wong, H. Konno and M. Kato, An Approach to
Surface Finishing Using a Newly Developed Magnetic Polishing Liquid (MPL),
International Journal for Manufacturing Science and Technology, Vol 5,
No.2 2003/2004，(2005）, pp.46-54.
31) Y. Wu, J. Wang, Y. Fan and M. Kato, Determination of Waviness Decrease
Rate by Measuring the Frequency Characteristics of the Grinding Force in
Centerless Grinding, Journal of Materials Processing Technology, Vol.170,
No.3 (2005), pp.563-569.
32) X. Wang, Y. Wu, J. Wang, W. Xu, Effect of incident angle on laser processing a small vitrified CBN grinding wheel, Journal of Dalian University of Technology, Vol.45, No.5, (2005), pp.672-675. (In Chinese)
33) 野村光由，呉 勇波，加藤正名，立花 亨，厨川常元，超音波振動を援用した小径内面の精密研削に関する研究―超音波振動による研削抵抗低減のメカニズム―，砥粒加工学会誌,
Vol.49, No.12 (2005), pp.691-696.
34) X. Wang, Y. Wu, R. Kang, D. Guo, W. Xu and M. Kato, Energy Model in
Laser Processing of a Cylindrical Grinding Wheel, Key Engineering Materials,
Vol.304-305, (2006), pp.33-37.
35) J. Jiang, Y. Wu, X. Wang and M. Kato, A New Magnetic Polishing Liquid (MPL) for Precision Surface Finishing, Key Engineering Materials, Vols.315-316, (2006), pp.671-675.
36) Y. Wu, Y. Fan and M. Kato, A Feasibility Study of Microscale Fabrication
by Ultrasonic-Shoe Centerless Grinding, Precision Engineering (the Journal
of the International Societies for Precision Engineering and Nanotechnology),
Vol.30, No.2, (2006), pp.201-210.
37) Y. Wu and M. Kato, Geometrical Arrangement of ID Grinding Wheel in
Simultaneous-ID/OD Combination Centerless Grinding, International J. Manuf.
Tech. Management (IJMTM), Vol.9, Nos. 1/2, 2006, pp.160-171.
38) X.Wang, Y. Wu, W. Xu, L. Wang, J. Wang, Effect of focal offset on energy distribution in laser truing grinding wheel, Chinese Mechanical Engineering, Vol.17. No.7, (2006), pp.702-705.
39) 呉 勇波，加藤正名，平面研削盤による超音波シューセンタレス研削の試み，砥粒加工学会誌, Vol.50, No.9 (2006), pp.525-530.
40) Y. Wu, X. Wang, T. Tachibana and M. Kato, Laser Truing and Dressing
of Small Vitrified CBN Grinding Wheel, Key Engineering Materials, Vol.
329, (2006), pp. 163-168.
41) Y. Wu, Y. Fan and M. Kato, Microscale Fabrication of Pin-shaped Machine Parts by a New Centerless Grinding Technique, International J. Nano-Manufacturing, Vol.1, No.1, (2006), pp.3-16.
42) H. Cheng, H. Tam, Y. Gao, Y. Wu, Y. Wang, Wear Characteristics of the
Sub-aperture Tools and Material Removal Rate in Precision Grinding with
Loose Abrasive, Key Engineering Materials, Vol. 329, (2007), pp. 69-74.
43) Y. Wu and M. Kato, Rounding Process of Workpiece in Throughfeed Centerless
Grinding with Large Grinding Allowance, Int. J. Computer Application in
Technology, Vols. 29, Nos.2-4, (2007), pp.96-101.
44) Y. Wu, K. Tetsuka and M. Kato, A New Magnetic Polishing Liquid (MPL) Proposed for Contact-free Surface Finishing: Part 2, Detailed Performances in Metal Surface Finishing, International Journal of Applied Electromagnetics and Mechanics, Vol.25, No.1-4, (2007), pp.89-94.
45) Y. Wu, M. Tamano and M. Kato, Inducing a Machine Spindle to Ultrasonically
Vibrate by Fluctuating Electromagnetic Force, International Journal of
Applied Electromagnetics and Mechanics, Vol.25, No.1-4, (2007), pp.621-626.
46) M. Nomura, Y. Wu and T. Kuriyagawa, Investigation of internal ultrasonically
assisted grinding of small holes: effect of ultrasonic vibration in truing
and dressing of small CBN grinding wheel, Journal of Mechanical Science
and Technology, 21, 10 (2007), pp.1605-1611.
47) 呉 勇波，小径ＣＢＮ砥石のレーザツルーイング/ドッレシング，砥粒加工学会誌，Vo.51, No.9, (2007), pp.518-521.
48) 呉 勇波，島田邦雄，水晶ウエーハの薄片加工におけるＭＣＦ研磨液の基本加工特性，実験力学，Vol.7, No.3 (2007), pp.221-226.
49) Yongbo Wu and Tsunemoto Kuriyagawa, An ultra-precision polishing technique
using high-velocity abrasive fluid, Int. J. Abrasive Technology, Vol.1,
No.2 (2007) pp.151-160.
50) W. Yang, Y. Wu and M. Kato, A New Approach to Silicon Wafer Edge Treatment by Ultrasonically Assisted Polishing (UAP), International Journal of Material and Product Technology (IJMPT), Vol.31, Nos.2/3/4 (2008), pp.159-175.
51) N. Kobayashi, Y. Wu, M. Nomura and T. Sato, Precision treatment of
silicon wafer edge utilizing ultrasonically assisted polishing technique,
Journal of Materials Processing Technology, Vol. 201, (2008), pp.531-535.
52) T. Furuya, Y. Wu, M. Nomura, Y. Shimada and K. Yamamoto, Fundamental
performance of magnetic compound fluid polishing liquid in contact-free
polishing of metal surface, Journal of Materials Processing Technology,
Vol. 201, (2008), pp.536-541.
53) 呉 勇波，立花 亨，センタレス研削における調整砥石の摩擦特性，砥粒加工学会誌，Vo.52, No.8, (2008), pp.449-453.
54) Yang Weiping, Wu Yongbo and Xu Jiawen, A Hybrid Technique of Ultrasonic-Elliptic-Vibration-Assited
Chemical-Mechanical Polishing and its Experimental Investigation, Mechanical
Science and Technology for Aerospace Engineering, Vol.27, No.7 (2008),
pp.841-847. (In Chinese)
55) K. Shimada, Y. Matuso, K. Yamamoto and Y. Wu , A New Float-Polishing
Technique with Large Clearance Utilizing Magnetic Compound Fluid, Int.
J. Abrasive Technology, Vol.1, Noｓ.3/4, (2008) pp.302-315.
56) Y. Wu, K. Shimada, and Y. C. Wong, Fundamental performance of MCF (Magnetic Compound Fluid) polishing tool in metal surface finishing, International Journal of Machining and Machinability of Materials (IJMMM), Vol.5, Nos.2/3 (2009), pp.232-244.
57) M. Nomura, Y. Wu, T. Kuriyagawa, T. Kawashima and T. Shibada, Effects
of Grain Size and Concentration of Grinding Wheel in Ultrasonically Assisted
Grinding, Key Engineering Materials, Vol. 389-390, (2009), pp. 283-288.
58) Y. Wu and K. Shimada, Quartz Wafer Machining using MCF (Magnetic Compound
Fluid) Polishing Liquid Frozen with Liquid Nitrogen, Key Engineering Materials,
Vol. 389-390, (2009), pp. 187-192.
59) H.P. Yuan, H. Gao, Y.J.Bao and Y. Wu, Grinding of Carbon/Expoxy Composites using Electroplated CBN Wheel with Controlled Abrasive Clusters, Key Engineering Materials, Vol. 389-390, (2009), pp. 24-29.
60) Y.Wu, T.Sato, W.Lin, K.Yamamoto and K.Shimada, The detailed Performance
of MCF Polishing Liquid in Nano-precision Surface Treatment of Acrylic
Resin, Advanced Materials Research, Vols. 76-78 (2009) pp.331-336.
61) Takashi Sato, Yongbo Wu, Weimin Lin and Kunio Shimada, Study of Three-Dimensional
Polishing using Magnetic Compound Fluid (MCF), Advanced Materials Research,
Vols.76-78 (2009) pp.288-293.
62) 佐藤隆史，呉 勇波，林 偉民，島田邦雄，変動磁場を利用したMCF研磨技術の開発，日本機械学会論文集B編，Vol.75, No.753 (2009) pp.1007-1012.
63) W. Xu, Yong Bo Wu, Takashi Sato, Z. Liang, W.M. Lin, Experimental Study
of Tangential-Feed Centerless Grinding Process Performed on Surface Grinder,
Materials Science Forum , Vols.626-627 (2009) pp.17-20.
64) W. Xu, Yong Bo Wu, Takashi Sato, Z. Liang, W.M. Lin, Simulation Investigation
of Tangential-Feed Centerless Grinding Process Performed on Surface Grinder,
Materials Science Forum , Vols.626-627 (2009) pp.23-28.
65) Z. Liang, Yong Bo Wu, X.B. Wang, Y. Peng, W. Xu, Wen Xiang Zhao, A Two-Dimensional Ultrasonically Assisted Grinding Technique for High Efficiency Machining of Sapphire Substrate, Materials Science Forum , Vols.626-627 (2009) pp.35-40.
66) Qiu Jianhui; Zhang Guohong, Wu Yongbo, Proposal of ultrasonic welding
technique and weld performances applied to polymers, Polymer Engineering
and Science, Vol.49, No.9, (2009) pp.1755-1759.
67) Yongbo Wu, Shota Yokoyama, Takashi Sato, Weimin Lin, Toru Tachibana,
Development of a new rotary ultrasonic spindle for precision ultrasonically
assisted grinding，International Journal of Machine Tools and Manufacture,
Vol.49, No.12/13, (2009/10) pp.933-938.
68) 許 衛星，呉 勇波，佐藤隆史，林 偉民，平面研削盤を用いた接線送り式センタレス研削法の開発，日本機械学会論文集C編，Vol.75, No.757 (2009) pp.2416-2422.
69) Y. Wu, T. Sato, W. Lin, K. Yamamoto and K. Shimada, Mirror surface
finishing of acrylic resin using MCF-based polishing liquid, International
Journal of Abrasive Technology, Vol.3, No.1 (2010) pp.11-24.
70) W. Xu, Y. Wu, T. Sato, W. Lin, Effects of process parameters on workpiece
roundness in tangential-feed centerless grinding using a surface grinder,
Journal of Materials Processing Technology, Vol.210, (2010) pp.759-766.
71) 呉 勇波，許 衛星，平面研削盤を用いた接線送り式センタレス研削法の開発―ワークテーブルの変速送りによる研削サイクルの短縮―，砥粒加工学会誌，Vo.54, No.6, (2010), pp.353-358．
72) Z. Liang, X. Wang, Y. Wu, T. Sato and W. Lin, A feasibility study on
elliptical ultrasonic assisted grinding of sapphire substrates, International
Journal of Abrasive Technology (IJAT), Vol.3, No.3, (2010), pp.190-202.
73) 呉 勇波，許 衛星，平面研削盤を用いた接線送り式センタレス研削法の開発―ワークテーブルの変速送りによる研削サイクルの短縮―，砥粒加工学会誌，Vo.54,
No.6, (2010), pp.353-358．
74) T. Sato, Y. Wu, W. Lin and K. Shimada, Study of Dynamic Magnetic Field Assisted Finishing for Metal Mold using Magnetic Compound Fluid (MCF), Key Engineering Materials, Vols. 447-448 (2010) pp.258-262.
75) Wang Z.Z, Y. Wu, L. Zhou, Guo Y.B. and Wu C.X, Two Dimensional Ultrasonic
Vibration Assisted Chemo-mechanical Grinding of Si Wafer, Advanced Materials
Research, Vols. 126-128 (2010), pp.282-288.
76) 佐藤隆史，呉 勇波，林 偉民，島田邦雄，磁気混合流体（MCF）による三次元研磨に関する研究，砥粒加工学会誌，Vol.54, No.7,
(2010), pp.425-430．
77) Z. Liang, X. Wang, Y. Wu and W. Zhao, Elliptical Ultrasonic Assisted Grinding (EUAG) of Monocrystal Sapphire-Surface Formation Characteristics-, Advanced Materials Research, Vols., 126-128 (2010), pp.367-373.
78) Y. Wu, Z. Liang, X. Wang and W. Lin, Elliptical Ultrasonic Assisted
Grinding (EUAG) of Monocrystal Sapphire-Wear Behaviors of Resin Bond Diamond
Wheel-, Advanced Materials Research, Vols., 126-128 (2010), pp.573-578.
79) Liang Zhiqiang, Wang Xibin, Yongbo Wu, Wenxiang Zhao, Peng Yunfeng,
Xu Weixing, Development of a Two-dimensional Ultrasonic Vibration Assisted
Grinding Technique of Monocrystal Silicon, Journal of Mechanical Engineering,
Vol.46, No.13 (2010), pp.192-198. (in Chinese)
80) Liang Zhiqiang, Wang Xibin, Yongbo Wu, Wenxiang Zhao, Peng Yunfeng,
Mechanism of Surface Formation for Two-dimensional Ultrasonic Vibration
Assisted Grinding of Monocrystal Silicon with Vertical Workpiece Vibration,
Journal of Mechanical Engineering, Vol.46, No.19 (2010), pp.171-176. (in
Chinese)
81) Zhiqiang Liang, Yongbo Wu, Xibin Wang, Wenxiang Zhao, Takashi Sato,
Weimin Lin, A New Two-dimensional Ultrasonic Assisted Grinding (2D-UAG)
Method and Its Fundamental Performance in Monocrystal Silicon Machining,
International Journal of Machine Tools and Manufacture, Vol.50, (2010),
pp.728-736.
82) Liu Renxin, Yang Weiping and Wu Yongbo, Experiment on Silicon Wafer Edge Hybrid Polishing of Ultrasonic Vibration and Chemical Mechanical, Transactions of the Chinese Society for Agricultural Machine, Vol.41, No.2, (2010), pp.220-226. (in Chinese)
83) Jianhui Qiu, Guohong Zhang, Mitsuhiro Asao, Min Zhang, Huixia Feng
and Yongbo Wu, Study on the novel ultrasonic weld properties of heterogeneous
polymers between PC and PMMA, International Journal of Adhesion & Adhesives,
Vol. 30, (2010) 729-734.
84) M. Nomura, Y. Wu, T.Kuriyagawa, T. Kawashima, and T. Shibata, Study
of Ultrasonically Assisted Internal Grinding of Small Holes: Effect of
Grain Size of cBN Grinding Wheel, Advanced Materials Research, Vols. 83-86(2010),
pp.1002-1008.
85) Yongbo Wu, Takashi Sato, Jianhui Qiu and Weimin Lin, Proposal of a New Ultrasonic Welding Technique for Thermoplastic Polymer, Advanced Materials Research Vols. 83-86 (2010) pp 1129-1134
86) Zhiqiang Liang, Xibin Wang, Wenxiang Zhao, Yongbo Wu, Takashi Sato,
Weimin Lin, A feasibility study on elliptical ultrasonic assisted grinding
of sapphire substrate, International Journal of Abrasive Technology (IJAT),
Vol.3, No.3 (2010) pp.190-202.
87) W. Xu and Y. Wu, A new in-feed centerless grinding technique using
a surface grinder, Journal of Materials Processing Technology, Vol.211,
(2011) pp.141-149.
88) Yongbo Wu and Weiping Yang, Fundamental Investigation of Silicon Wafer Edge Treatment by Ultrasonically Assisted Polishing (UAP), International Journal of Material and Product Technology (IJMPT), Vol.40, Nos.3/4 (2011), pp.264-276.
89) Guohong Zhang, Jianhui Qiu, Liang Shao, Mingzhu Liu, Min Zhang, Yongbo
Wu, Ultrasonic weld properties of heterogeneous polymers: Polylactide and
poly (methyl methacrylate), Journal of Materials Processing Technology,
Vol. 211, No. 8 (2011) pp. 1358-1363.
90) Weixing Xu and Yongbo Wu, A new through-feed centerless grinding technique
using a surface grinder, Journal of Materials Processing Technology, Vol.
211 (2011), pp.1599-1605.
91) Yongbo Wu, Yaguo Li, Zhenzhong Wang, Wei Yang, Libo Zhou, Performance improvement of chemo-mechanical grinding in single crystal silicon machining by the assistance of elliptical ultrasonic vibration, International Journal of Abrasive Technology (IJAT), Vol.4, No.2 (2011) pp.117-131.
92) Yongbo Wu, Zhiqiang Liang, Masakazu Fujimoto and Weimin Lin, Surface
Formation Characteristics in Elliptical Ultrasonic Assisted Grinding of
Monocrystal Silicon, International Journal of Nanomanufacturing (IJNM),
Vol.7, Nos. 3/4 (2011), pp.189-198.
93) X.Y. Wang, H.R. Guo, Y.B. Wu, W.J. Xu and D.M. Guo, Laser cladding
of micro-fluidic channel mold, Advanced Materials Research Vols. 216 (2011)
pp 424-429.
94) Y.F. Peng, Z.Q. Liang, Y.B. Wu, Y.B. Guo, T. Jiang and X. Chen, Research on the Ducttle Chip Formation in Grinding of Brittle Materials, Key Engineering Materials, Vol. 487 (2011) pp.58-62.
95) Zhiqiang Liang, Xibin Wang, Yongbo Wu, Experimental Investigations
of Elliptical Ultrasonic Assisted Grinding (EUAG) of Monocrystal Sapphire,
International Journal of Abrasive Technology (IJAT), Vol.4, No.4 (2011)
pp.279-289.
96) Z.Z. Wang, Y.B. Guo and Y.B. Wu, Development of a Two-dimensional Ultrasonic
Vibration Assisted Machining Technology with Tool Vibration, Key Engineering
Materials, Vol. 487 (2011) pp.419-422.
97) Yaguo Li, Yongbo Wu, Jian Wang, Wei Yang, Yinbiao Guo and Qiao Xu, Tentative investigation towards precision polishing of optical components with ultrasonically vibrating bound-abrasive pellets, Optics Express, Vol.20, No.1 (2012), pp.568-575.
98) Weixing Xu, Yongbo Wu, Simulation investigation of through-feed centerless
grinding process performed on a surface grinder, Journal of Materials Processing
Technology, Vol. 212 (2012), pp.927-935.
99) Zhiqiang Liang, Xibin Wang, Yongbo Wu, An Investigation on Wear Mechanism
of Resin-bonded Diamond Wheel in Elliptical Ultrasonic Assisted Grinding
(EUAG) of Monocrystal Sapphire, Journal of Materials Processing Technology,
Vol.212, No.4 (2012) pp.868-876.
100) Dong Lu, Hongfu Huang, Yongbo Wu and Mingming Yang, Finite Element Analysis for Ti-6Al-4V in Ultrasonic-Vibration-Assisted Micro-Cutting, Advanced Materials Research Vol. 500 (2012) pp 345-350.
101) 林 偉民, 大村元志，藤本正和，呉 勇波，山形 豊: 自転／公転型研磨法の新提案と高精度形状研磨の基礎研究, 砥粒加工学会誌, 56,
4 (2012) pp.256-261.
102) Y. Peng, Y. Wu, Z.Q. Liang, Y. B. Guo and X. Lin, An Experimental
Study of Ultrasonic Vibration-assisted Grinding of Polysilicon Using Two-Dimensional
Vertical Workpiece Vibration, International Journal of Advanced Manufacturing
Technology, Vol.54 (2011) pp.941-947.
103) Weixing Xu, Yongbo Wu, Masakazu Fujimoto, Toru Tachibana: A new ball machining method by centerless grinding using a surface grinder, International Journal of Abrasive Technology (IJAT), Vol.5, No.2 (2012) pp.107-118.
104) Yaguo Li, Yongbo Wu, Libo Zhou, Masakazu Fujimoto, Jian Wang, Qiao
Xu, Shoichi Sasaki1, and Masaaki Kemmochi, Chemo-Mechanical Manufacturing
of Fused Silica by Combining Ultrasonic Vibration with Fixed-Abrasive Pellets,
International Journal of Precision Engineering and Manufacturing, Vol.13,
No.12 (2012) pp.2163-2172.
105) Huiru Guo and Yongbo Wu, Behaviors of MCF (Magnetic Compound Fluid)
Slurry and its Mechanical Characteristics: Normal and Shearing Forces under
a Dynamic Magnetic Field, Journal of JSEM (Japan Society for Experimental
Mechanics), Vol.12, No.4 (2012) pp.369-374.
106) Y. Wu, L. Jiao, H. Guo, M. Fujimoto and K. Shimada, Ultrafine Surface Finishing of Fused Silica Glass Using MCF Magnetic Compound Fluid Wheel, Advanced Materials Research Vol. 565 (2012) pp 3-9.
107) WeiXing Xu, LC Zhang, and Yongbo Wu, Micromechanical Modelling of
Elliptic Vibration-Assisted Cutting of Unidirectional FRP Composites, Advanced
Materials Research Vols. 591-593 (2012) pp 531-534.
108) Yaguo Li, Y. Wu, Libo Zhou, Huiru Guo and Jianguo Cao, Investigation
into Chemo-Mechanical Fixed Abrasive Polishing of Fused Silica with the
Assistance of Ultrasonic Vibration, Key Engineering Materials, Vols. 523-524
(2012), pp.155-160.
109) H.R. Guo., Y. Wu, Y.G. Li, J.G. Cao, M.Fujimoto and S.D. Jacobs, Technical Performance of Zirconia-coated Carbonyl-iron-particles based Magnetic Compound Fluid Slurry in Ultrafine Polishing of PMMA, Key Engineering Materials, Vols. 523-524 (2012), pp.161-166.
110) Jianguo Cao, Y. Wu, HUiru Guo, Yaguo Li, M.Fujimoto and A. Ohmura,
Simulation Investigation Ultrasonically Assisted Grinding of SiC ceramics
with Single Diamond Abrasive Grain, Key Engineering Materials, Vols. 523-524
(2012), pp.178-183.
111) Weiping Yang, Yongbo Wu and Jun Liu, Experimental Investigation on
Hybrid Technology of Ultrasonic Vibration Assisted Chemo-Mechanical Grinding
(CMG) Silicon Wafer, Applied Mechanics and Materials, Vols.275-277 (2013),
pp.2290-2294.
Ⅱ．国際会議Proceedings論文
112) Y. Wu，T. Kuriyagawa and K. Syoji, Real Time Monitoring of Centerless Grinding Process Using Wavelet Transform, Abrasive Technology (Current Development and Application Ⅰ), November, （1999）, pp.25-30. (Brisbane, Australia).
113) Y. Guo, K. Syoji，T. Kuriyagawa and Y. Wu, A High-efficiency Machining
Method for Quartz Wafer with Flexible Belt Wheel, Proceedings of 5th International
Conference on Progress of Machining Technology, October,（2000）, pp.29-34.
(Xi’an, China).
114) Y. Wu，M. Kato, K. Syoji and T. Kuriyagawa, Design of Grinding Cycle
in Centerless Infeed Grinding, Advances in Abrasive Technology Ⅲ, October,
（2000）, pp. 268-273. (Hawaii, USA).
115) Y. Wu，M. Kato, K. Syoji and T. Kuriyagawa, Investigation of Workpiece
Rounding Process and Optimum Grinding conditions in Centerless Grinding,
Proceedings of 2000 International Conference on Advanced Manufacturing
Systems and Manufacturing Automation, June, (2000), pp1026-1029. (Guangzhou,
China).
116) Y. Wu，M. Kato, K. Syoji, T. Kuriyagawa and T. Tachibana, Evaluation of Grinding Conditions Using Dynamic Components of Grinding Force in Centerless Grinding, America Society for Precision Engineering, October, Vol.25 （2001）, pp.441-444. (Washington DC, USA).
117) Y. Wu，M. Kato, K. Syoji and T. Kuriyagawa, High Velocity Fluid Polishing
of Optical Components, Proceedings of Fifth International Conference on
Frontiers of Design and Manufacturing, June, Vols.2, （2002）, pp.268-273.
(Dalian, China).
118) Y. C. Wong, Y. Wu, K. Shimada and M. Kato, The Effects of Polishing
with Magnetic Compound Fluid, Proceedings of the Fifth International Conference
& Awareness Workshop on Behaviour of Materials in Machining, （2002）,
November, pp.293-296. (Chester, UK).
119) K. Shimada, Y. Wu and Y. C. Wong, Experimental Investigation of the Effect of the MPL (Magnetic Polishing Liquid) on Surface Finishing, Proceedings of SPIE’s International Symposium on Smart Materials, Nano-, and Micro-Smart Systems, November, Vol.4936, （2002）, pp.312-320. (Melbourne, Australia).
120) Y. Wu, Y. Fan, M. Kato, T. Kuriyagawa, K. Syoji and T. Tachibana,
Development of an Ultrasonic Elliptic Vibration Shoe Centerless Grinding
Technique, Advances in Materials and Processing Technology (AMPT2003),
July, Vols.2, (2003), pp.936-939. (Dublin, Ireland).
121) Y. Fan, Y. Wu, M. Kato and T. Tachibana, Computer Simulation of Ceramic
Bearing Ball’s Sphericizing Process in Centerless Ball Grinding, Proceedings
of First International Conference on Knowledge Economy and Development
of Science and Technology "Knowledge Economy meets Science and Technology"
(KEST2003), Sept., (2003), pp.200-205. (Honjo, Japan).
122) H. Konno, Y. Wu, K. Shimada, Y. C. Wong and M. Kato, A New Magnetic Polishing Liquid (MPL) for Precision Surface Finishing, Proceedings of First International Conference on Knowledge Economy and Development of Science and Technology "Knowledge Economy meets Science and Technology" (KEST2003), Sept., (2003), pp.206-211. (Honjo, Japan).
123) Y. Wu, Y. Fan, M. Kato and T. Tachibana, Design of the Ultrasonic
Elliptic Vibration Shoe and its Performance in Ultrasonic Elliptic Vibration
Shoe Centerless Grinding, Proceedings of International Conference on Leading
Edge Manufacturing in 21th Century (LEM21), Nov., (2003), pp.257-262. (Niigata,
Japan).
124) Y. Wu, M. Nomura, M. Kato and T. Tachibana, Fundamental Investigation
of Internal Ultrasonic Vibration Assisted Grinding of Small Holes, Proceedings
of International Conference on Leading Edge Manufacturing in 21th Century
(LEM21), Nov., (2003), pp.145-150. (Niigata, Japan).
125) Y. Wu, Y. C. Wong, K. Shimada, H. Konno and M. Kato, An Approach to Surface Finishing Using a Newly Developed Magnetic Polishing Liquid (MPL), Proceedings of International Conference on Precision Engineering 2004 (ICoPE2004), March, (2004), pp.498-505. (Singapore).
126) Y. Wu, T. Kondo and M. Kato, Geometrical Arrangement of ID Grinding
Wheel in Simultaneous-ID/OD Combination Centerless Grinding, Proceedings
of 7th International Symposium on Advances in Abrasive Technology (ISAAT2004),
June, (2004), pp.301-305. (Bursa, Turkey).
127) X. Wang, Y. Wu and J. Wang, Effect of Incident Angle and Critical
Angle on Laser Processing of a Small Vitrified CBN Grinding Wheel, Proceedings
of 7th International Symposium on Advances in Abrasive Technology (ISAAT2004),
June, (2004), pp.295-300. (Bursa, Turkey).
128) Y. Wu, T. Kondo and M. Kato, A Centerless Grinding Unit Used for Precisely Processing Ferrules of Optical Fiber Connector, Proceedings of SPIE, Vol. 5650, Dec., (2004), pp.356-364. (Sydney, Australia).
129) Y. Wu, T. Kondo, M. Kato, A new centerless grinding technique using
a surface grinder, Proceedings of 8th International Conference on Advances
in Materials and Processing Technology, May, (2005), pp.599-512. (Wista,
Poland).
130) K. Shimada, Y. Wu, Y. Matsuo, K. Yamamoto, Float polishing technique
using new tool consisting of micro magnetic clusters, Proceedings of 8th
International Conference on Advances in Materials and Processing Technology,
May, (2005), pp.547-550. (Wista, Poland).
131) X. Wang, Y. Wu, J. Wang, W. Xu, M. Kato, Absorbed energy in laser truing of a small vitrified CBN grinding wheel, Proceedings of 8th International Conference on Advances in Materials and Processing Technology, May, (2005), pp.595-598. (Wista, Poland).
132) Y. Wu, K. Tetsuka, M. Kato, K. Shimada, Y. C. Wong, A New Magnetic
Polishing Liquid (MPL) Proposed for Contact Force-free Surface Finishing:
Part 1, Behaviour under Magnetic field and Fundamental Performance in Metal
Surface Finishing, Proceedings of 12th International Symposium on Interdisciplinary
Electromagnetic, Mechanic & Biomedical Problems, Sept., (2005), pp.150-151.
(Bad Gastein, Austria).
133) Y. Wu, K. Tetsuka, M. Kato, K. Shimada, Y. C. Wong, A New Magnetic
Polishing Liquid (MPL) Proposed for Contact Force-free Surface Finishing:
Part 2, Detailed Performances in Metal Surface Finishing, Proceedings of
12th International Symposium on Interdisciplinary Electromagnetic, Mechanic
& Biomedical Problems, Sept., (2005), pp.152-153. (Bad Gastein, Austria).
134) Y. Wu, M. Tamano and M. Kato, Inducing a Machine Spindle to Ultrasonically Vibrate by Fluctuating Electromagnetic Force, Proceedings of 12th International Symposium on Interdisciplinary Electromagnetic, Mechanic & Biomedical Problems, Sept., (2005), pp.400-401. (Bad Gastein, Austria).
135) Y. Wu, Y. Fan and Masana Kato, Controlling the Workpiece Rotation
Speed with an Ultrasonic Regulator in Microscale Centerless Grinding, Proceedings
of 3rd International Conference on Leading Edge Manufacturing in the 21st
Century (LEM21), Oct., 19-22, (2005), pp.1223-1228. (Nagoya, Japan).
136) Y. Wu, M. Kato, J. Jiang, X. Wang, K. Shimada and Y. C. Wong, New
Polishing Method with MCF (Magnetic Compound Fluid) Polishing Tool, Proceedings
of International Conference on Precision Engineering and Micro/Nano Technology
(ASPEN2005), Vol.1, Nov., (2005), pp.141-146. (ShenZhen, China).
137) Y. C. Wong, Y. Wu, M. Kato and K. Shimada, The Polishing of Soldering on H13 steel with Magnetic Compound Fluid, Proceedings of International Conference on Precision Engineering and Micro/Nano Technology (ASPEN2005), Vol.1, Nov., (2005), pp.136-140. (ShenZhen, China).
138) Y. Wu, K. Shimada, T. Kuriyagawa, An Ultra-precision Polishing Technique
using High-velocity Abrasive Fluid, Proceedings of 9th International Conference
on Advances in Materials and Processing Technology (AMPT2006), July 30
–August 3, (2006), SEⅠ4-403 (CD-ROM). (Las Vegas, USA).
139) Y. Wu, K. Shimada, T. Kuriyagawa, The Behavor of Abrasive Particles
in High-velocity Abrasive Fluid Polishing, Proceedings of 9th International
Conference on Advances in Materials and Processing Technology (AMPT2006),
July 30 –August 3, (2006), SEⅠ.4 -404 (CD-ROM),. (Las Vegas, USA).
140) K. Shimada, Y. Matsuo, K. Yamamoto, R. Hanamura, T. Sahasi, Y. Wu, Study on New Float Polishing with Large Clearance utilizing Magnetic Compound Fluid - Polishing Mechanism and Effects of Polishing Parameters -, Proceedings of 9th International Conference on Advances in Materials and Processing Technology (AMPT2006), July 30 –August 3, (2006), SEⅡ.3-244 (CD-ROM). (Las Vegas, USA).
141) K. Shimada, Y. Matsuo, K. Yamamoto, R. Hanamura, T. Sahasi, Y. Wu,
Study on New Float Polishing with Large Clearance utilizing Magnetic Compound
Fluid - - Possibility and Examples of the MCF Polishing Technique -, Proceedings
of 9th International Conference on Advances in Materials and Processing
Technology (AMPT2006), July 30 –August 3, (2006), SE Ⅱ. 3-245 (CD-ROM).
(Las Vegas, USA).
142) Y. Wu and M. Kato, Rounding Process of Workpiece in Throughfeed Centerless
Grinding with Large Grinding Allowance, Proceedings of the International
Conference on Surface Finishing Technology and Surface Engineering (ICSFT2006),
Sept. 24-27, (2006), pp.379-386. (Dalian, China).
143) M. Nomura, Y. Wu and T. Kuriyagawa, Investigation of internal ultrasonically assisted grinding of small holes: effect of ultrasonic vibration in truing and dressing of small CBN grinding wheel, Proc. 10th Int. Conf. on Advances in Materials Processing Technology (AMPT2007), Oct. 7-11, (2007), pp.203. (Daejeon, Korea).
144) Ｔ. Furuya, Y. Wu, M. Nomura, K. Shimada and K. Yamamoto, Fundamental
performance of MCF (Magnetic Compound Fluid) polishing liquid contact-free
polishing of metal surface, Proc. 10th Int. Conf. on Advances in Materials
Processing Technology (AMPT2007), Oct. 7-11, (2007), pp.1199-1208. (Daejeon,
Korea).
145) N. Kobayashi, Y. Wu and M. Nomura, Precision treatment of silicon
wafer edge utilizing ultrasonically assisted polishing (UAP) technique,
Proc. 10th Int. Conf. on Advances in Materials Processing Technology (AMPT2007),
Oct. 7-11, (2007), pp.1190-1198. (Daejeon, Korea).
146) Y. Wu and T. Tachibana, Friction coefficient of regulating wheel in centerless grinding, Proc. ISAAT2007, Sept. 25-28, (2007), pp.311-318. (Dearborn, USA).
147) Liu Shengping, Wu Yongbo and Wei Yunlong, The Effect of Surface Roughness
of Substrates on Properties of Reconstituted Biomembranes, Proc. ThinFilms2008
(4th International Conference on Technological Advances of Thin Films and
Surface Coatings), July 13-16, (2008), pp.256-261. (Singapore)
148) S. Yokoyama, Y. Wu, T. Sato, W. Lin and T. Tachibana, Development
of a New Rotary Ultrasonic Spindle for Precision Ultrasonically Assisted
Grinding, Abstract book of 11th Int. Conf. on Advances in Materials Processing
Technology (AMPT2008), Nov. 2-5, (2008), pp.232. (Bahrain)
149) M. Nomura, Y. Wu, T. Kuriyagawa, T. Kawashima and T. Shibata, Study of Ultrasonically Assisted Internal Grinding of Small Holes: The effect of Grain Size of CBN Grinding Wheel, Abstract book of 11th Int. Conf. on Advances in Materials Processing Technology (AMPT2008), Nov. 2-5, (2008), pp.277. (Bahrain)
150) Y. Wu, T. Sato, J. Qiu and W. Lin, Proposal of a New Ultrasonic Welding
Technique for Thermoplastic Polymer, Abstract book of 11th Int. Conf. on
Advances in Materials Processing Technology (AMPT2008), Nov. 2-5, (2008),
pp.162. (Bahrain)
151) M. Nomura, Y. Wu, T. Kuriyagawa, T. Kawashima and T. Shibada, Effects
of Grain Size and Concentration of Grinding Wheel in Ultrasonically Assisted
Grinding, Proceedings of the 11th International symposium on Advances in
Abrasive Technology (ISAAT2008)，pp.283-288, Sep30-Oct3, 2008, Awajishima-city,
Japan.
152) Y. Wu and K. Shimada, Quartz Wafer Machining using MCF (Magnetic Compound Fluid) Polishing Liquid Frozen with Liquid Nitrogen, Proceedings of the 11th International symposium on Advances in Abrasive Technology (ISAAT2008)，pp.187-192, Sep30-Oct3, 2008, Awajishima-city, Japan.
153) H.P. Yuan, H. Gao, Y.J.Bao and Y. Wu, Grinding of Carbon/Expoxy Composites
using Electroplated CBN Wheel with Controlled Abrasive Clusters, Proceedings
of the 11th International symposium on Advances in Abrasive Technology
(ISAAT2008)，pp.24-29, Sep30-Oct3, 2008, Awajishima-city, Japan.
154) Takashi Sato, Yongbo Wu, Weimin Lin and Kunio Shimada, Study of Three-Dimensional
Polishing using Magnetic Compound Fluid (MCF), Proceedings of the 12th
International symposium on Advances in Abrasive Technology (ISAAT2009)，pp.288-293,
Sep27-30, 2009, Gold Coast, Australia
155) Y.Wu, T.Sato, W.Lin, K.Yamamoto and K.Shimada, The detailed Performance of MCF Polishing Liquid in Nano-precision Surface Treatment of Acrylic Resin, Proceedings of the 12th International symposium on Advances in Abrasive Technology (ISAAT2009), pp.331-336, Sep27-30, 2009, Gold Coast, Australia.
156) Y.Wu, Y.Takahashi, T.Sato, W.Lin and M.Take, Effects of Ultrasonic
Vibration in Truing/Dressing of Small Metal Bonded Diamond Grinding Wheel
used for Internal Grinding, Proceedings of AMPT2009, pp.125, Oct26-29,
2009, Kuala Lumpur, Malaysia.
157) Yuta Inagaki, Yongbo Wu, Takashi Sato, Weimin Lin and Kunio Shimada,
A feasibility study on the thinning process of quartz wafer using MCF Polishing
Liquid, Proceedings of AMPT2009, pp.256, Oct26-29, 2009, Kuala Lumpur,
Malaysia.
158) W. Xu, Y.Wu, T.Sato and W.Lin, A Method to Increase Material Removal Rate in Tangential-feed Centerless Grinding Performed on Surface Grinder, Proceedings of LEM21, pp.559-562, Dec2-4, 2009, Osaka University, Japan.
159) Z. Liang, Y. Wu, T.Sato and W.Lin, X. Wang and W. Zhao, Two-dimensional
Ultrasonically Assisted Grinding of Monocrystal Silicon, Proceedings of
LEM21, pp.535-540, Dec2-4, 2009, Osaka University, Japan.
160) T. Sato, Y. Wu, W. Lin and K. Shimada, Study of dynamic magnetic field
assisted finishing for metal mold using magnetic compound fluid (MCF),
Proceedings of ICoPE2010, Singapore.
161) Z.Q. Liang, X.B. Wang, Y. B. Wu, W.X. Zhao, Y.F. Peng, T. Sato, Wear Characteristics of Diamond Wheel in Elliptical Ultrasonic Assisted Grinding (EUAG) of Monocrystal Silicon, SPIE Proceedings (Proc. AOMTT-International Symposium on Advanced Optical Manufacturing and Testing Technologies-2010), April 26-29, 2010, Dalian, China
162) Y. Peng, Y. Wu, Z. Liang, Y. Guo, Kinematical Characteristics of Two-Dimensional
Vertical Ultrasonic Vibration-assisted Grinding Technology, SPIE Proceedings
(Proc. AOMTT-International Symposium on Advanced Optical Manufacturing
and Testing Technologies-2010), April 26-29, 2010, Dalian, China
163) Y. Wu and W. Xu, Fabrication of Microscale Cylindrical Parts by Ultrasonic-shoe
Centerless Grinding, Proc. Of ISMNM2010, pp.149-153, Aug. 18-20, 2010,
Guilin, China. (Invited)
164) M. Fujimoto and Y. Wu, Nano Polishing of Three-dimensional Micro Structure Using Magnetic Compound Fluid (MCF), Proc. Of ISMNM2010, pp.149-153, Aug. 18-20, 2010, Guilin, China. (Invited).
165) Y. Wu and Z. Liang, Surface Formation Characteristics in Elliptical
Ultrasonic Assisted Grinding of Monocrystal Silicon, Proc. of NanoMan2010,
pp. 38, Sept. 24-27, 2010, Tianjin, China (invited).
166) Y. Wu, T. Sato and W. Lin, MCF Polishing Process for Free-formed Resin
Devices using Robotic Arm, AIP Conference Proceedings, Vol. 1315, pp. 979-984
( Proc. AMPT2010, pp.299, Oct. 24-27, 2010, Paris, France).
167) W. Xu, Y. Wu, T. Sato and W. Lin, Performing in-feed type centerless grinding process on a surface grinder, AIP Conference Proceedings, Vol. 1315, pp. 985-990 (Proc. AMPT2010, pp.301, Oct. 24-27, 2010, Paris, France).
168) M. Fujimoto, Y. Wu and J. Cao, High Precision Ultrasonically Assisted
Internal Grinding (UAIG) of Difficult-to-machining Materials using Metal
Bonded Diamond Wheels, Proc. LEM21 (CD Rome), Nov. 8-10, 2011, Omiya, Saitama,
Japan.
169) Yaguo Li, Yongbo Wu, Precision Manufacturing of Fused Silica Glass
by Combining Bound-Abrasive Polishing with Ultrasonic Vibration, Proc.
6th International Symposium on Advanced Optical Manufacturing and Testing
Technologies (AOMATT 2012), April 26-29, 2012, Xiamen, China
170) Yaguo Li, Yongbo Wu, Masakazu Fujimoto, Libo Zhou, Polishing fused silica glass by incorporating ultrasonic vibration into fixed abrasive polishers, Proceedings of the 12th euspen International Conference (Stockholm, June 2012), pp.344-347.
171) Masakazu Fujimoto, Yongbo Wu, Hidenari Kanai and Masahiko Jin, Grinding
Characteristics of Mold Steel with Miro 3D Structure in Ultrasonically
Assisted Precision Grinding, International Journal of Nanomanufacturing
(IJNM), Proc. of NanoMan2012, RIKEN, Tokyo, July 25-27, 2012.
172) Yaguo Li and Yongbo Wu, Hybrid Polishing of Fused Silica Glass with
Bound-Abrasive Polishers in Conjunction with Vibration, Proc. of SPIE,
Vol. 8486, 84860N-2, 2012.8 in USA
173) Yongbo Wu, Weiping Yang and Masakazu Fujimoto, A feasibility study of silicon wafer treatment by ultrasonic-assisted fixed-abrasive CMP (UF-CMP), Proc. of Int. Conf. of Manuf. Tech. Engineers (ICMTE2012), 2012.10.18-19 in Seoul, Korea.
Ⅲ．総説・解説
174) 呉 勇波，心なし研削加工における研削抵抗の測定，砥粒加工学会誌，44，11, 2000, pp.566-569.
175) 野村光由，呉 勇波，加藤正名，立花 亨，超音波振動を援用した小径内面の研削加工―超音波振動スピンドルの試作と基本研削特性―，超音波TECHNO，Vol.15,
No.4, 2003，pp.24-27.
176) 呉 勇波，調整車を無くして本当にセンタレス研削ができるのか―着想から検証まで―，砥粒加工学会誌，48，7，2004，pp.383-384.
177) 呉 勇波，研究室紹介，砥粒加工学会誌，Vol.48, No.4, 2004.pp.202-203.
178) 呉 勇波，超音波シュー心無し研削法の開発，超音波TECHNO，Vol.17, No.5, 2005，pp.57-61.
179) 呉 勇波，超音波シュー心無し研削による微小径部品の創成加工，超音波TECHNO，Vol.18, No.1, 2006，pp.34-38.
180) 呉 勇波，平面研削盤を用いた超音波シュー心無し研削法，超音波TECHNO，Vol.18, No.2, 2006，pp.62-66.
181) 野村光由，呉 勇波，加藤正名，立花 亨，厨川常元，小径内面の超音波援用研削に関する研究―超音波振動による研削抵抗低減のメカニズム―，超音波TECHNO，Vol.18, No.4, 2006，pp.83-86.
182) 呉 勇波，研究室紹介「秋田県立大学知能機械システム工学研究室」，超音波TECHNO，Vol.18. No.6, 2006.pp.111-114.
183) 呉 勇波，超音波や磁場の援用による加工技術のさらなる高度化を目指して，精密工学会誌，Vol.73, No.5, 2007, pp.541-542.
184) 野村光由，呉 勇波，加藤正名，立花 亨，厨川常元，小径内面の超音波援用研削に関する基礎研究―小径砥石のツルーイング・ドレッシングにおける超音波振動の効果―，超音波TECHNO，Vol.20, No.3, 2008，pp.85-88.
185) 呉 勇波，佐藤隆史，林 偉民，楊 衛平，超音波援用研磨によるシリコンウエーハエッジのトリートメント①―平面研磨による基礎加工特性の検討―，超音波TECHNO，Vol.21,
No.5, 2009，pp.64-68.
186) 呉 勇波，横山将太，佐藤隆史，林 偉民，岳 将士，小径内面の超音波援用精密研削に関する研究―メタルボンドダイヤモンド小径砥石のツルーイング・ドレッシング―，超音波TECHNO，Vol.21,
No.5, 2009，pp.69-73.
187) 呉 勇波，佐藤隆史，林 偉民，楊 衛平，超音波援用研磨によるシリコンウエーハエッジのトリートメント②―実験装置の試作と二，三の加工実験―，超音波TECHNO，Vol.21, No.6, 2009，pp.38-42.
188) 呉 勇波，野村光由，立花 亨，超音波振動を用いた高精度内面研削技術，砥粒加工学会誌，53，12，2009，pp.729-732.
189) Liang Z., Wang X., Wu Y., Li Y., Zhao W., Pang S., Status and progress
of ultrasonic assisted grinding technology, Acta Armamentarii, Vol. 31,
No.11 (2010), p.1465-1470. (in Chinese)
190) 呉 勇波，佐藤隆史，島田邦雄，磁場作用下MCF(磁気混合流体)スラリーの挙動と微細3Ｄ表面の鏡面研磨における基礎加工特性，実験力学，Vol.11, No.3 (2011)，p.273-276.
191) 呉 勇波，藤本正和，難削材小径内面の超音波援用鏡面研削，超音波TECHNO，Vol.23, No.6, 2011，pp.58-62.
192) 呉 勇波，生産と加工に関する学術講演会2012について（１），日本機械学会 生産加工・工作機械部門ニュースレター「ものづくりの技術」，2012/5/
193) 呉 勇波，機械工学年鑑―研削・研磨加工―，日本機械学会誌，Vol. 115, No.1125, (2012) pp.59.
194) 呉 勇波，藤本正和，梁志強，スパイラル超音波援用研削法の提案と単結晶シリコン研削時の基本加工特性，超音波TECHNO，Vol.224,
No.6, 2012，pp.43-47.
Ⅳ. 研究報告書
195) 呉 勇波，平成13年度斉藤憲三顕彰会研究助成金「超音波表面波による工作物の回転制御に基づくマイクロ円筒体のセンタレス研削法の開発」研究報告書，2002.3.
196) 呉 勇波， 平成12-13年度科研費「マイクロ円筒体の高精度・高能率センタレス研削法の開発センタレス研削」研究成果報告書，2002.4.
197) 呉 勇波，御器谷科学技術財団研究助成金「マイクロ部品のセンタレス研削加工に関する研究」研究報告書，2003.9.
198) 加藤正名，呉 勇波： 平成13-14年度科研費「センタレス研削方式によるセラミックス球の枚葉型加工技術の開発に関する研究」研究成果報告書，2004.2.
199) 呉 勇波，精密センタレス研削のシミュレーション解析，ミクロン精密受託研究報告書，2004.3.
200) 呉 勇波，大澤科学技術振興財団研究助成金「超音波楕円振動シュー心無し研削による微小径マイクロ部品の高精度高効率加工に関する研究」研究報告書，2005.4.
201) 呉 勇波，凍結MCFポリシングツールによる水晶ウェーハの薄片化加工の基礎研究，関東経済産業局（ＦＤＫ株式会社）受託研究報告書，2007.2.
202) 呉 勇波，JSTシーズ発掘試験「電磁力励振式超音波スピンドルを備えた小径内面の精密加工装置の開発」研究報告書，2007.3.
203) 呉 勇波，大澤科学技術振興財団研究助成金「平面研削盤を用いる多品種少量生産に適したセンタレス研削法の開発に関する研究」研究報告書，2007.4.
204) 呉 勇波， 平成17-18年度科研費「平面研削盤を用いる多品種少量生産に適したセンタレス研削法の開発」研究成果報告書，2007.6.
205) 呉 勇波，平成19年度秋田県重点分野国際共同研究推進事業「マイクロレーザ加工とナノＭＣＦ研磨による微細３Ｄ構造を有する金型の高能率高精度加工製作技術の研究開発」研究報告書，2008.3.
206) 呉 勇波，（財）本荘由利産業科学技術振興財団調査研究助成事業「ﾏｲｸﾛﾚｰｻﾞﾋﾞｰﾑによるﾏｲｸﾛ化学分析ｼｽﾃﾑ製作用金型の高精度加工技術の開発」研究成果報告書，2008.4.
207) 呉 勇波：秋田県重点分野国際共同研究事業「マイクロレーザ加工とナノMCF研磨による微細３D構造を有する金型の高能率高精度加工製作技術の研究開発」H20年度研究成果報告書，2009.4.
208) 呉 勇波：平成19-20年度科研費「電磁力励振式超音波スピンドルの試作と小径内面の鏡面研削への適用」研究成果報告書，2009.5
209) 呉 勇波：秋田県重点分野国際共同研究事業 「マイクロレーザ加工とナノMCF研磨による微細３D構造を有する金型の高能率高精度加工製作技術の研究開発」
H21年度研究成果報告書，2010.4.
210) 呉 勇波：H21年度秋田県立大学学長プロジェクト「LEDサファイア基盤の超音波援用高能率薄片加工におけるマイクロ材料除去機構の実験的解明」，2010.3
211) 呉 勇波：H21年度秋田県立大学産学共同研究推進事業「先進光電材料の超音波微振動援用研削における加工特性の実験的調査と加工条件の最適化検討」研究成果報告書，2010.3
212) 呉 勇波：H21年度大澤科学技術振興財団国際交流助成「AMPT2009（マレーシア）」成果報告書，2010.4
213) 呉 勇波：H22年度秋田県立大学産学共同研究推進事業「超音波楕円微振動を援用した機械化学複合研削によるSiウエハエッジの高能率エコトリートメント技術の開発」研究成果報告書，2011.3
214) 呉 勇波：H22年度秋田県立大学研究シーズ育成事業「磁気混合流体を利用した機能性硬脆材料の高精度・高能率・ダメージレス研磨法の開発」研究成果報告書，2011.3
215) 呉 勇波：H22年度秋田県研究開発シーズ育成支援事業「超音波楕円微振動を援用した機械・化学複合加工によるSiウエハエッジの高能率エコトリートメント技術の開発」研究成果報告書，2011.3
216) 呉 勇波： Ｈ22年度大澤科学技術振興財団国際交流助成「AMPT2010（フランス・パリ）」成果報告書，2011.4
217) 呉 勇波：ミクロン精密株式会社委託研究 「球体センタレス研削におけるスルフィード加工プロセスの解析」 H23年度研究成果報告書，2011.8.
218) 呉 勇波：木村製作所株式会社委託研究「ガラスレンズ製造用金型部材内面の精密研削加工技術の開発」H23年度研究成果報告書，2012.4.
219) 呉 勇波：H23年度秋田県立大学産学共同研究推進事業「超音波楕円微振動を援用した機械化学複合研削によるSiウエハエッジの高能率エコトリートメント技術の開発」研究成果報告書，2012.3
その他分担執筆報告書6件
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システム科学技術学部 機械知能システム学科