@
Faculty of Systems Science and Technology
Department of Machine Intelligence and Systems Engineering
Advanced Machining Technology Laboratory
(Prof. Wu & Assoc. Prof. Nomura)

Themes

Ultra Precision Polishing using Magnetic Compound Fluid (MCF)
High precision polishing of fused silica using MCF wheel
Manufacturing of nano smooth surface by MCF polishing
High precision polishing of SiC ceramics using MCF slurry
Polishing of inner wall of capillary
Design of multi axis controlled MCF polishing system
 
Ultrasonic Assisted High Efficiency Machinning Process
Ultrasonic assisted grinding of superalloy
Ultrasonic assisted turning of titanium alloy using cBN tools
High precision processing of difficult-to-materials using ultrasonic assisted internal grinding
Ultrasonic vibrasion assisted chemo-mechanical fixed-abrasive machining of optical glass
Si wafer polishing using ultrasonic vibrasion assisted chemo-mechanical fixed-abrasive machining
High efficiency machining of sapphire wafer using spiral ultrasonic assisted grinding
Manufacturing of mirror free form surface by ultrasonic assisted grinding
Edge treatment of Si wafer by ultrasonic assisted chemo-mechanical fixed abrasive machining
 
High Efficiency and Precision Cutting of Future Aircraft Materials
Drilling of future aircraft materials using rotation & revolution type grinding
High efficiency cutting process using micro end mill
High precision drilling process using micro tools
 
 
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